Evolution of Copper Microstructure Subjected to Combined Twisting and Drawing Technology

METALLOFIZIKA I NOVEISHIE TEKHNOLOGII, 2024

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DOI 10.15407/mfint.46.02.0121
Data confidence 70 medium
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Abstract

This work studies evolution of copper microstructure during a combined deformation process.The essence of this process is in deformation of copper wire in a rotating equal-channel stepped matrix with subsequent drawing.Deformed wire is examined using transmission electron microscopy and EBSD analysis.After three cycles of deformation, an ultrafine-grained gradient microstructure with a high component of high-angle grain boundaries is obtained.