Swelling studies on poly(n, n-dimethyl acrylamide-co-acrylic acid) hydrogels

2021

Full text Open access: Gold Metadata (CSL-JSON)
DOI 10.26577/ijbch.2021.v14.i2.011
Data confidence 70 medium
How this score is calculated

It is built from checkable properties of the record itself: whether the article has a DOI, how many independent sources confirmed its data, whether the required fields are filled in, and how recent the latest confirmation is. Disagreement between sources and a missing identifier lower it. A value of 80 or above means the record was published without further checking; 60 to 79 means it is published at reduced confidence, with a manual check advisable. A record verified by an editor by hand is never pushed below 90 by a recalculation. This scores our data about the article, not the article itself.

Abstract

Hydrogel copolymers based on N, N-dimethyl acrylamide (DMA) and acrylic acid (АAc) were synthesized with different molar composition ratios ([DMA-AAc] = 30÷70, 50÷50 and 70÷30) using ammonium peroxydisulfate as a free radical initiation system and in the presence of various amounts of N, N’-methylene bis (acrylamide) as a crosslinker agent (0.05, 0.1 and 0.3 mol. %) and water as reactant medium. The swelling technique characterized the obtained copolymer by different amounts to added of the crosslinking agent. While a large amount of crosslinking agent in the poly (DMA-co-AAc) hydrogels was reduced the swelling degree in the water medium, a smaller amount in the gel indicated the tendency of the gel to burst. Absorption studies were made using on different concentrations of copper sulphate (CuSO4). Poly (DMA-co-AAc) hydrogels absorption capacity is competitive when there is more N, N-dimethyl acrylamide content in copolymer than others. The swelling ratios of low concentration of Cu (II) ion are higher than those of higher concentration of Cu (II) ion. Hydrogel gave the highest swelling ratio for the solution containing the lowest Cu (II) ion concentration than for the solution containing the highest Cu (II) ion.