Abstract
Novel procedure of electrochemical chelation of polyimide films was developed. The kinetics of silver cation sorptions into the films during the chelation was found out. The effect of modification treatment of film surfaces on kinetics of electrochemical process was studied. The stabilization of ion-sorbed layer of films occurs in water-isopropanol solvents. Sorption of silver during electrochemical deposition is 0.75-1.5 mg per 100 µm of polyimide depending on modification solution. Thus, the most appropriate morphological modification with about 1.5 mg/100 µm take places in heterocyclic solvents. The resulting metallized polyimide films show good non-washing out adhesion of metal into gel-like structured surfacial layers of the film.