Abstract
Electroconductive and reflective metallized polyimide films have been prepared by heterogeneous chemical modification of polyimide surface. By carrying out the chemical reactions in situ in the modified layers of polyimide surface, thereby a metal phase strongly impregnated into the polyimide surface is obtained. The steps of chemical modification have been studied on the model compound – poly(amic acid) on the basis of pyromellite dianhydride and oxydianiline, which forms insoluble sodium or potassium poly(amicacid) salts (polyamate). Metallization of Kapton® HN & JP (from DuPont) and Upilex® S films have been carried out and the films have been characterized by XRD, XRFD, and measurements of reflectivity in the visible range and surface resistivity at elevated temperatures. It is shown that reflectivity coefficients of silvered films are 90-92% and surface resistivity is about 0.5 Ω.