Physical and Technological Characteristic Features of the Process of Installation of Dies onto a Temporary Foundation in Internal Wiring Technology

D. V. Vertyanov, Н. Е. Коробова, Anton V. Pogudkin, В. Д. Кравцова

2020

Closed access Metadata (CSL-JSON)
DOI 10.1134/s1063784220100230
Data confidence 70 medium
How this score is calculated

It is built from checkable properties of the record itself: whether the article has a DOI, how many independent sources confirmed its data, whether the required fields are filled in, and how recent the latest confirmation is. Disagreement between sources and a missing identifier lower it. A value of 80 or above means the record was published without further checking; 60 to 79 means it is published at reduced confidence, with a manual check advisable. A record verified by an editor by hand is never pushed below 90 by a recalculation. This scores our data about the article, not the article itself.

Abstract

Abstract The physical and technological characteristic features of the installation of dies onto a temporary foundation in the internal wiring technology are studied. The justified selection of the material for the fixation of silicon dies active side down onto a temporary foundation from various solutions of polyamic acids (PAAs) is performed. The experimental dependence of the adhesion strength of silicon dies on the lifetime of the solutions of PAAs is found. The possible defects formed upon the imidization of PAAs in the process of creation of highly integrated microassemblies, multidie modules, and electronic modules of the “system in package” level are shown.