Abstract
Currently, the cooling of electronic circuits is one of the most serious problems due to the exponential growth in demand for ever more powerful computer systems; overheating of these components becomes a serious problem. This article presents a number of computational results obtained by simulating a two-dimensional air flow for cooling occurring in a vertical channel. The area under study contains two square blocks simulating a set of electronic elements that are evenly installed in the vertical direction. The 2-D conjugate model of heat transfers between a solid body and an air flow is used with defined boundary conditions. In particular, the basic partial differential equations are approximated by the finite volume method. To study the impact of different parameters on the resulting heat transfer inside the channel, calculations are made for various parameters: Reynolds number, materials, and geometric parameters.