Abstract
The effect of irradiation of copper films with low-energy He 2+ ions on their structural properties has been studied. The surface morphology and structural properties of the samples before and after irradiation have been examined by scanning electron microscopy, energy dispersive analysis, and X-ray diffraction. Bombardment of the initial samples with He 2+ ions at a fluence of 1 × 10 16 ion/cm 2 alters the surface morphology of copper films and leads to the formation of nanoscale inclusions of hexagonal shape. An increase in the fluence to 1 × 10 17 ion/cm 2 and higher results in the formation of cracks and amorphous oxide inclusions on the sample surface.