Germanium ``hexa'' detector: production and testing

Milija Sarajlić, David Pennicard, S. Smoljanin, H. Hirsemann, Bernd Struth, T. Fritzsch, M. Rothermund, M. Zuvic, M.O. Lampert, Mshari A. Askar

1 more author

Heinz Graafsma

2017

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DOI 10.1088/1748-0221/12/01/c01068

Data confidence 70 medium

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Abstract

Here we present new result on the testing of a Germanium sensor for X-ray radiation. The system is made of 3 × 2 Medipix3RX chips, bump-bonded to a monolithic sensor, and is called ``hexa''. Its dimensions are 45 × 30 mm 2 and the sensor thickness was 1.5 mm. The total number of the pixels is 393216 in the matrix 768 × 512 with pixel pitch 55 μ m. Medipix3RX read-out chip provides photon counting read-out with single photon sensitivity. The sensor is cooled to −126°C and noise levels together with flat field response are measured. For −200 V polarization bias, leakage current was 4.4 mA (3.2 μ A/mm 2 ). Due to higher leakage around 2.5% of all pixels stay non-responsive. More than 99% of all pixels are bump bonded correctly. In this paper we present the experimental set-up, threshold equalization procedure, image acquisition and the technique for bump bond quality estimate.