Abstract
Purpose The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model. Design/methodology/approach Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed. Findings It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration. Originality value It is confirmed.