Abstract
Perovskites have already shown potential as active layers in photovoltaic applications. Furthermore, a low-cost and simple solution processing technology allows perovskites to be used in flexible and printed electronics. Perovskite solar cells (PSC) with a back-contact (BC) structure, in which the electrode system is based on a quasi-interdigitated back-contact (QIBC) design, promise to increase the power conversion efficiency (PCE) of devices beyond those that can be obtained using PSCs with a traditional sandwich structure. While the spin-coating technique is used to deposit the perovskite layer of lab-scale BC PSCs, the application of large-area printing techniques to deposit the perovskite layer of such devices is yet to be explored. Therefore, this work demonstrates an application of the slot-die coating technique to print the perovskite active layer of BC PSCs with QIBC electrodes on flexible polymer substrates. The morphology of the obtained perovskite films on QIBC electrodes are investigated and the primary photoelectric parameters of the resulting BC PSCs are measured. The charge carrier recombination processes in the fabricated BC PSCs are investigated and the dominant mechanism for carrier loss in the devices is determined. The findings of the work give an insight into the properties of the slot-die-coated perovskite active layer of BC PSCs and points to exciting new research opportunities in this direction.