FACILE FABRICATION OF MXENE/SIC-BASED ELECTROCHEMICAL INK ELECTRODES

2026

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DOI 10.51889/acs.2026.1.1.002
Data confidence 70 medium
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Abstract

In this study, MXene/SiC-based conductive ink electrodeswere successfully fabricated using a simple and low-cost direct writing method for potential electrochemical applications. The objective of this work was to develop a facile fabrication strategy for conductive composite ink by combining two-dimensional MXene nanosheets with silicon carbide (SiC) nanoparticles to improve the conductivity, structural stability, and adhesion of printed electrodes. MXene was synthesized by selective etching of the Ti₃AlC₂ MAX phase, and the obtained MXene nanosheets were mixedwith SiC nanoparticles to prepare conductive ink. Chitosan solution was employed as a binder to enhance the adhesion and mechanical stability of the conductive coating on a polyvinyl chloride (PVC) substrate. The prepared conductive ink was manually deposited onto the PVC substrate using a direct writing technique and dried at room temperature.The morphology and elemental composition of the fabricated electrodes were characterized by scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS). The SEM images revealed a homogeneous distribution of MXene and SiC particles, while the EDS analysis confirmed the successful incorporation of Ti, C, Si, and other constituent elements into the composite electrode. The fabricated electrodes exhibited uniform film formation, good adhesion to the substrate, and favorable conductive characteristics, demonstrating the feasibility of the proposed fabrication method for conductive electrode preparation. These results indicate that the MXene/SiC composite ink is a promising material for the development of flexible and low-cost electrochemical electrodes. The proposed approach provides a simple, scalable, and cost-effective strategy for fabricating conductive electrodes with potential applications in electrochemical sensors, printed electronics, energy storage devices, and other flexible electronic systems