Low-Cost Teflon Substrate for Enhanced Performance of 60 GHz Patch Antenna for 5G Wireless Applications

2026

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DOI 10.1109/ictp67998.2026.11485365
Data confidence 70 medium
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Abstract

This paper presents the design of a low-cost 60GHz millimeter wave frequency microstrip patch antenna for 5G wireless communication using a Teflon substrate. The design of the presented antenna utilizes a dielectric substrate with a relative permittivity of 2, thickness of 0.254 mm and a loss tangent of 0.0009. There are two antenna designs studied, single element microstrip patch antenna and the other is a four-element antenna array. In both designs, a patch of copper is printed on the top of the substrate, and a slotted ground plane is used on the lower layer to enhance the radiation characteristics. The effect of antenna size and antenna array structure on important performance parameters, such as impedance bandwidth, gain, and directivity were analyzed through CST Microwave Studio. The simulation results indicate that the array design offers better gain and directivity than the single-element design with acceptable bandwidth of 5G short range communication. The four-element array has a reflection coefficient of -22.048 dB at 60 GHz, and it has stable VSWR characteristics. The performance of the antennas is further confirmed by three-dimensional radiation patterns and electric fields distributions. The findings confirm the Teflon substrates are an effective and affordable way of using the millimeter-wave microstrip antennas in 5G Wireless Communication applications.