Аннотация
Additive manufacturing (AM) is a rapidly advancing method with the ability to produce complex geometries layer by layer. AM shows great promise for joining dissimilar metals. However, direct energy deposition (DED) of nitinol (NiTi) and 316 stainless steel (SS316L) encounters significant difficulties due to the development of brittle Fe-Ti intermetallic compounds. A copper alloy (CuSn10) interlayer was introduced to prevent their formation. This study utilizes a wire- and powder-based DED approach, eliminating the need for feedstock switching. Fine CuSn10 powder was specifically applied for the interlayer, resulting in distinct bonding mechanisms at the interfaces. Interdiffusion resulted in fishbone microstructures at the CuSn10-SS316L interface, whereas the NiTi-CuSn10 interface exhibited dendritic structures with evenly distributed elements. Microhardness analysis revealed a sharp variation across the layers, with the highest value observed at the NiTi-CuSn10 interface (529 HV0.2). This study shows the potential of using wire- and powder-based DED technology to join dissimilar metals.